K522H1HACB-B060

GENERAL DESCRIPTION

The K522H1HACF is a Multi Chip Package Memory which combines 2G bit NAND Flash and 1G bit Mobile DDR synchronous Dynamic RAM. NAND cell provides the most cost-effective solution for the solid state application market. A program operation can be performed in typical 250μs on the (2K+64)Byte page and an erase operation can be performed in typical 2ms on a (128K+4K)Byte block. Data in the data register can be read out at 42ns cycle time per Byte. The I/O pins serve as the ports for address and data input/output as well as command input. The on-chip write controller automates all program and erase functions including pulse repetition, where required, and internal verification and margining of data. Even the write-intensive systems can take advantage of the device′s extended reliability of 100K program/erase cycles by providing ECC(Error Correcting Code) with real time mapping-out algorithm. The device is an optimum solution for large nonvolatile storage applications such as solid state file storage and other portable applications requiring non-volatility.

FEATURES

• Operating Temperature : -25°C ~ 85°C
• Package : 153ball FBGA Type - 8x9x1.0mmt, 0.5mm pitch

** **

• Voltage Supply : 1.7V ~ 1.95V
• Organization
- Memory Cell Array :
(256M + 8M) x 8bit for 2Gb
(512M + 16M) x 8bit for 4Gb DDP
- Data Register : (2K + 64) x 8bit
• Automatic Program and Erase
- Page Program : (2K + 64)Byte
- Block Erase : (128K + 4K)Byte
• Page Read Operation
- Page Size : (2K + 64)Byte
- Random Read : 40μs(Max.)
- Serial Access : 42ns(Min.)
• Fast Write Cycle Time
- Page Program time : 250μs(Typ.)
- Block Erase Time : 2ms(Typ.)
• Command/Address/Data Multiplexed I/O Port
• Hardware Data Protection
- Program/Erase Lockout During Power Transitions
• Reliable CMOS Floating-Gate Technology
- Endurance : 100K Program/Erase Cycles
with 1bit/512Byte ECC for x8,
• Command Driven Operation
• Unique ID for Copyright Protection

** **

• VDD/VDDQ = 1.8V/1.8V
• Double-data-rate architecture; two data transfers per clock cycle.
• Bidirectional data strobe (DQS).
• Four banks operation.
• Differential clock inputs (CK and CK).
• MRS cycle with address key programs.
- CAS Latency (2, 3)
- Burst Length (2, 4, 8, 16)
- Burst Type (Sequential & Interleave)
• EMRS cycle with address key programs.
- Partial Array Self Refresh (Full, 1/2, 1/4 Array)
- Output Driver Strength Control (Full, 1/2, 1/4, 1/8, 3/4, 3/8, 5/8, 7/8)
• Internal Temperature Compensated Self Refresh.
• All inputs except data & DM are sampled at the positive going edge of the system clock (CK).
• Data I/O transactions on both edges of data strobe, DM for masking.
• Edge aligned data output, center aligned data input.
• No DLL; CK to DQS is not synchronized.
• DM for write masking only.
• Auto refresh duty cycle.
- 7.8us for -25 to 85 °C
• Clock stop capability.