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S3C6432XH-53
S3C6432XH-53 S3C6432XH-53 - Brand New SAMSUNG IC Chips
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S3C6432XH-53

S3C6432XH-53 - Brand New SAMSUNG IC Chips

Manufacturer Part No: S3C6432XH-53 In Stock
MOQ: 1pcs
Category: IC Chips
Condition
Quantity
Shipping:
Free ShippingEstimated 15-30 business days via Registered Air Mail or othersSee details
Delivery:
Estimated between Thu, May 7 and Mon, May 11.This item requires 2-5 business days for processing before shipping after payment is confirmed. And depending on the destination and shipping method.See details
Return:
60 days returns. Buyer pays for return shippingSee details
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  • One-month free return and one year warranty.
  • Full or Partial Refund, if the item is not as described
  • Full Refund if you don't receive your order
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ManufacturerSAMSUNG
Product CategoryIC Chips

Product Details

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ARCHITECTURAL OVERVIEW

The S3C6410X is a 16/32-bit RISC microprocessor, which is designed to provide a cost-effective, low-power capabilities, high performance Application Processor solution for mobile phones and general applications. To provide optimized H/W performance for the 2.5G & 3G communication services, the S3C6410X adopts 64/32-bit internal bus architecture. The 64/32-bit internal bus architecture is composed of AXI, AHB and APB buses. It also includes many powerful hardware accelerators for tasks such as motion video processing, audio processing, 2D graphics, display manipulation and scaling. An integrated Multi Format Codec (MFC) supports encoding and decoding of MPEG4/H.263/H.264 and decoding of VC1. This H/W Encoder/Decoder supports real-time video conferencing and TV out for both NTSC and PAL mode. Graphic 3D (hereinafter 3D Engine) is a 3D Graphics Hardware Accelerator which can accelerate OpenGL ES 1.1 & 2.0 rendering. This 3D Engine includes two programmable shaders: one vertex shader and one pixel shader.

The S3C6410X has an optimized interface to external memory. This optimized interface to external memory is capable of sustaining the high memory bandwidths required in high-end communication services. The memory system has dual external memory ports, DRAM and Flash/ROM. The DRAM port can be configured to support mobile DDR, DDR, mobile SDRAM and SDRAM. The Flash/ROM port supports NOR-Flash, NAND-Flash, OneNAND, CF and ROM type external memory.

To reduce total system cost and enhance overall functionality, the S3C6410X includes many hardware peripherals such as a Camera Interface, TFT 24-bit true color LCD controller, System Manager (power management & etc.), 4-channel UART, 32-channel DMA, 5-channel 32bit Timers with 2PWM output, General Purpose I/O Ports, I2S-Bus interface, I2C-BUS interface, USB Host, USB OTG Device operating at high speed (480Mbps), 3-channel SD/MMC Host Controller and PLLs for clock generation.

The ARM subsystem is based on the ARM1176JZF-S core. It includes separate 16KB Instruction and 16KB data caches, 16KB Instruction and 16KB Data TCM. It also includes a full MMU to handle virtual memory management. The ARM1176JZF-S is a single chip MCU, which includes support for JAVA acceleration. The ARM1176JZF-S includes a dedicated vector floating point coprocessor allowing efficient implementation of various encryption schemes as well as high quality 3D graphics applications. The S3C6410X adopts the de-facto standard AMBA bus architecture. These powerful, industry standard features allow the S3C6410X to support many of the industry standard Operating Systems.

By providing a complete set of common system peripherals, the S3C6410X minimizes overall system costs and eliminates the need to configure additional components. The S3C6410X is implemented using an advanced 65nm CMOS process. The low-power, simple, elegant and fully static-design scheme is particularly suitable for cost sensitive and power-sensitive applications.

We provide two kinds of POP product which is based on S3C6410X.

The 6410X PoP A TYPE is a POP(Package On Package) product stacked with S3C6410X and MCP Memory
(2G OneNAND + 512Mb Moblie DDR x 2ea)
The 6410X PoP D TYPE is a POP(Package On Package) product stacked with S3C6410X and MCP Memory
(2Gb NAND + 512Mb OneDRAM + 512Mb Mobile DDR)

Shipping

Item location:China
Ships to:Worldwide
First item Additional item Service Description
$0.00 Free Free Shipping Estimated 15-30 business days via Registered Air Mail or others
$27.50 Free Expedited Shipping Estimated delivery time is 3-5 business days, with some areas possibly taking 6-9 business days depending on the shipping address. The main courier companies include but are not limited to UPS, DHL, and FedEx.
$0.00 Free Buyer cooperating carrier Using buyer's cooperating carrier. Buyer should create a shipping label and share it to us. And then we will call carrier for pickup
$38.00 Free Expedited Shipping Estimated delivery time is 3-5 business days, with some areas possibly taking 6-9 business days depending on the shipping address. The main courier companies include but are not limited to UPS, DHL, and FedEx.
Please contact us if need

Delivery

  • The transportation time may be delayed due to customs clearance, local holidays or abnormal events.
  • The estimated time is based on the fastest speed provided by commercial couriers (DHL, FedEx, UPS etc).
  • The estimated time does not include the lead time of the item. The lead time of most items is 2–5 business days. If more than 5 working days are needed, we will manually confirm with you.
FlagCountryExpress DeliveryStandard Delivery
United StatesUnited States3 - 5 days10-15 days
CanadaCanada3 - 5 days10-20 days
MexicoMexico3 - 5 days10-17 days
GermanyGermany3 - 5 days10-12 days
ItalyItaly3 - 5 days10-15 days
United KingdomUnited Kingdom3 - 5 days10-12 days

Estimated Delivery

Estimated between Thu, May 7 and Mon, May 11.

This item requires 2-5 business days for processing before shipping after payment is confirmed. And depending on the destination and shipping method.

Return Policy

Return window Refund type Return shipping
60 days after receiving item Money Back or Replacement Buyer pays for return shipping
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